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Learn UCIe – the open standard for chiplet-based die-to-die interconnects. Covers UCIe physical and protocol layers, die-to-die adapter architecture, advanced and standard packaging form factors, and UCIe IP integration strategy.
₹25000
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Learn HBM3 – the ultra-high-bandwidth memory used in AI accelerators and GPUs. Covers HBM3 architecture, 3D stacking (TSV), wide 1024-bit interface, refresh management, thermal design, and HBM3 PHY interface. Essential for AI chips, GPUs, and network processors.
₹25000
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Master CXL – the emerging coherent interconnect for CPU-accelerator-memory systems. Covers CXL 1.1/2.0/3.0 specifications, CXL.io, CXL.cache, CXL.mem, and CXL switch topology. Essential for AI accelerator, HPC, and data centre SoC engineers.
₹25000
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Hours