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Back-End-of-Line BEOL and Interconnects

Back-End-of-Line BEOL and Interconnects

₹12500

₹25000

Learn BEOL interconnect fabrication for modern ICs. Covers copper dual-damascene process, barrier layers, low-k dielectric materials, via and metal formation, CMP, RC delay modelling, and electromigration reliability. Essential for Physical Design engineers who need to understand the fabrication bas

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Has discount
Expiry period Lifetime
Made in English
Last updated at Sun Apr 2026
Level
Intermediate
Total lectures 0
Total quizzes 0
Total duration Hours
Total enrolment 0
Number of reviews 462
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Short description Learn BEOL interconnect fabrication for modern ICs. Covers copper dual-damascene process, barrier layers, low-k dielectric materials, via and metal formation, CMP, RC delay modelling, and electromigration reliability. Essential for Physical Design engineers who need to understand the fabrication bas
Outcomes
  • Understand core concepts of BEOL Semiconductor Interconnects Metallisation Copper
  • Apply practical workflows in BEOL
  • Build job-ready skills for Nano Fab Courses
  • Work with BEOL
  • Work with back-end-of-line
  • Work with metallisation
  • Work with via
  • Work with interconnect
Requirements
  • Basic understanding of electronics and circuits
  • A laptop/desktop with stable internet
  • Suitable for professionals
  • Recommended for process / pd engineer
  • Tools access can be enabled with this course