Deep-dive into CMOS Front-End-of-Line (FEOL) fabrication. Covers wafer preparation, thermal oxidation, diffusion and ion implantation, photolithography patterning, etching, CVD deposition, CMP, and MOSFET formation with impact on device electrical characteristics.
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| Expiry period | Lifetime | ||
| Made in | English | ||
| Last updated at | Sun Apr 2026 | ||
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| Total lectures | 0 | ||
| Total quizzes | 0 | ||
| Total duration | Hours | ||
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| Number of reviews | 518 | ||
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| Short description | Deep-dive into CMOS Front-End-of-Line (FEOL) fabrication. Covers wafer preparation, thermal oxidation, diffusion and ion implantation, photolithography patterning, etching, CVD deposition, CMP, and MOSFET formation with impact on device electrical characteristics. | ||
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