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Rigid-Flex and Advanced PCB Packaging

Rigid-Flex and Advanced PCB Packaging

₹25000

₹50000

Design rigid-flex and HDI PCBs for advanced applications. Covers flex circuit design rules, bend radius constraints, rigid-flex stackup, HDI microvia design, blind and buried vias, any-layer HDI, and DFM in rigid-flex. Targeted at engineers designing wearable, medical, aerospace, and mobile product

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Has discount
Expiry period Lifetime
Made in English
Last updated at Sun Apr 2026
Level
Advanced
Total lectures 0
Total quizzes 0
Total duration Hours
Total enrolment 0
Number of reviews 676
Avg rating
Short description Design rigid-flex and HDI PCBs for advanced applications. Covers flex circuit design rules, bend radius constraints, rigid-flex stackup, HDI microvia design, blind and buried vias, any-layer HDI, and DFM in rigid-flex. Targeted at engineers designing wearable, medical, aerospace, and mobile product
Outcomes
  • Understand core concepts of Rigid Flex PCB HDI Advanced Packaging Design
  • Apply practical workflows in Advanced Packaging
  • Build job-ready skills for PCB Courses
  • Work with rigid-flex PCB
  • Work with flexible PCB
  • Work with FPC
  • Work with HDI
  • Work with microvias
Requirements
  • Basic understanding of electronics and circuits
  • A laptop/desktop with stable internet
  • Suitable for professionals
  • Recommended for pcb design engineer